Sr. Engineer, Infrastructure Engineering

Required

• 10+ years of hands-on PCB layout experience for complex, high-density electronic systems
• Expert-level capability in at least one major PCB layout platform, such as Cadence Allegro, Altium Designer, and working familiarity across common PCB design and review tools
• Demonstrated experience laying out multi-layer high-speed digital, mixed-signal, precision analog, RF, clock, and power designs
• Strong knowledge of PCB stack-ups, materials, controlled impedance, differential routing, length matching, crosstalk mitigation, return paths, grounding, and power integrity fundamentals
• Experience with fine-pitch BGAs, HDI, microvias, via-in-pad, blind/buried vias
• Practical knowledge of PCB fabrication, assembly processes, component land patterns, solder-mask and paste-mask design, panelization, tolerances, and manufacturing documentation
• Experience applying DFM, DFA, and DFT principles and working directly with fabrication and assembly suppliers
• Ability to interpret schematics, mechanical drawings, PCB specifications, component datasheets, and constraint documents
• Strong attention to detail, configuration discipline, and ability to manage multiple board releases and design revisions
• Clear written and verbal communication skills and the ability to work effectively across engineering and manufacturing teams
• Desired Characteristics & Attributes:
• Bachelor’s degree, technical certification, or equivalent practical experience in electronics, electrical engineering, PCB design, or a related field